SYLGARD® 184 Siliconelastomer Kit
Lieferant: DOW CORNING
Dow silicone 10 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/PCB system assembly applications. Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement.
- Flowable
- Room temperature and heat cure
- Good dielectric properties
- Rapid, versatile cure processing controlled by temperature
- High transparency allows easy inspection of components
The 10 to 1 mix ratio these products are supplied in gives one latitude to tune the modulus and hardness for specific application needs and production lines. In most cases de-airing is not required.
Spezifikation Testergebnisse
Viscosity (Base) | 5100 cP |
Viscosity (Mixed) | 3500 cP |
Thermal Conductivity | 0,15 btu/hr ft °F |
Specific Gravity (Cured) | 1,03 |
Dielectric Strength | 500 volts/mil |
Volume Resistivity | 2.9E+14 ohm*cm |
Tensile Strength | 980 psi |
Refractive Index @ 589 nm | 1.4118 |
Dissipation Factor at 100 Hz | 0.00257 |
Dielectric Constant at 100 Hz | 2.72 |
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