Kupfer ≥99% (Metall-Basis), Pulver -325 mesh, 10% max +325 mesh
Lieferant: Thermo Scientific
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Achtung
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13990.18EA
45.3
EUR
13990.18
13990.36
13990.A3
13990.A9
Kupfer ≥99% (Metall-Basis), Pulver -325 mesh, 10% max +325 mesh
Copper
Formel:
Cu Molecular Weight: 63,55 g/mol Siedepunkt: 2595 °C (1013 hPa) Schmelzpunkt: 1083 °C Dichte: 8,94 g/cm³ (20 °C) Lagertemperatur: Raumtemperatur |
MDL:
MFCD00010965 CAS-Nummer: 7440-50-8 EINECS: 231-159-6 UN: 3089 ADR: 4.1,III Merck Index: 13,02545 |
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