Kupfer ≥99% (Metall-Basis), Pulver -325 mesh, 10% max +325 mesh

Lieferant: Thermo Scientific
Achtung

13990.18EA 45.3 EUR
13990.18 13990.36 13990.A3 13990.A9
Kupfer ≥99% (Metall-Basis), Pulver -325 mesh, 10% max +325 mesh
Copper
Formel: Cu
Molecular Weight: 63,55 g/mol
Siedepunkt: 2595 °C (1013 hPa)
Schmelzpunkt: 1083 °C
Dichte: 8,94 g/cm³ (20 °C)
Lagertemperatur: Raumtemperatur
MDL: MFCD00010965
CAS-Nummer: 7440-50-8
EINECS: 231-159-6
UN: 3089
ADR: 4.1,III
Merck Index: 13,02545

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