Kupfer ≥99,8% (Metall-Basis), dünne Folie, Dicke 0.01 mm (0.0003 in)
Lieferant: Thermo Scientific
35815.FFEA
58.7
EUR
35815.FF
35815.GH
35815.FI
Kupfer ≥99,8% (Metall-Basis), dünne Folie, Dicke 0.01 mm (0.0003 in)
Copper
Formel:
Cu Molecular Weight: 63,55 g/mol Siedepunkt: 2595 °C (1013 hPa) Schmelzpunkt: 1083 °C Dichte: 8,94 g/cm³ (20 °C) Lagertemperatur: Raumtemperatur |
MDL:
MFCD00010965 CAS-Nummer: 7440-50-8 EINECS: 231-159-6 Merck Index: 13,02545 |
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